Two-Component Silicone Encapsulating Compound 021

Description

Curing takes place at room temperature. The material provides a thermal conductivity and low expansion. Ideal for encapsulating or filling gaps in heat-generating electronic components with metal enclosures or heat sinks. Has an excellent fluidity when dosing and encapsulating. After curing it does not detach due to the cyclic heating from the surface to which it adheres. The cured product is dry to the touch.

How to use

The system must be cleaned, degreased and dried. Add the contents of the syringe (hardener) to the container with the compound and mix thoroughly. Pour over the system and season for approx. 24 hours at the room temperature.

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