New MLX90640 IR Array Thermal Imaging Camera, 32×24 Pixels, 55° FOV View larger

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MLX90640 IR Array Thermal Imaging Camera, 32×24 Pixels, 55° FOV

0104110000085436

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MLX90640 IR Array Thermal Imaging Camera, 32×24 Pixels, 55° FOV



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2 Items

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499,00 lei
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Valid in the limit of the available stock

The price includes the costs for collection, treatment and ellimination of WEEE

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DESCRIPTION


IR Array Thermal Imaging Camera

MLX90640, 32×24 IR Array
Small Size, Non-Contact, Low Cost


Features At A Glance

The MLX90640-D55 Thermal Camera is a small size, non-contact, and low cost IR array thermal imaging camera, with 32×24 pixels. It will detect the IR distribution of objects in the field of view, turn the data into surface temperature of the objects by calculation, and then generate thermal images, for easy integration into miscellaneous industrial or intelligent control applications.

  • Adopts MLX90640 far-infrared thermal sensor array, 32×24 pixels
  • Communicating via I2C interface, configurable to fast mode (up to 1MHz data rate)
  • Noise Equivalent Temperature Difference (NETD) 0.1K RMS@1Hz refresh rate
  • Onboard voltage translator, compatible with 3.3V/5V operating voltage
  • Programable frame rate 0.5~64Hz (0.25~32FPS)
  • Comes with development resources and manual (examples for Raspberry Pi/Arduino(ESP32)/STM32)

Typical applications:

  • High precision non-contact temperature measurements
  • IR thermal imaging devices, IR thermometers
  • Smart home, intelligent building, intelligent lighting
  • Industrial temperature control, security & safety, intrude/movement detection


Specifications

OPERATING VOLTAGE 3.3V/5V CURRENT < 23mA
FIELD OF VIEW (FOV) 55o × 35o ABSOLUTE ACCURACY ±2oC (ambient temp. 0 ~ 50oC)
COMMUNICATION BUS I2C (0x33 by default) REFRESH RATE 0.5~64Hz (0.25~32FPS)
TARGET TEMPERATURE RANGE -40 ~ 300oC OPERATING TEMPERATURE -40 ~ 85oC
DIMENSIONS 28 × 16mm MOUNTING HOLE SIZE 2.0mm


I2C Control Interface

Supports Host Boards Including Raspberry Pi/Arduino(ESP32)/STM32...

VCC 3.3V/5V power input
GND GND
SDA connects to MCU I2C data pin
SCL connects to MCU I2C clock pin


Outline Dimensions


PACKAGE CONTENT

Weight: 0.007 kg

  1. MLX90640-D55 Thermal Camera x1
  2. PH2.0 4PIN wire x1



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MLX90640 IR Array Thermal Imaging Camera, 32×24 Pixels, 55° FOV

MLX90640 IR Array Thermal Imaging Camera, 32×24 Pixels, 55° FOV

MLX90640 IR Array Thermal Imaging Camera, 32×24 Pixels, 55° FOV



See description for more details about the product.

Add to cart now!